HVAC controller with integrated wireless network processor chip

ABSTRACT

A controller in a building management system (BMS) includes an integrated wireless network processor chip. The integrated wireless network processor chip includes a wireless radio, a processor, and memory. The wireless radio is configured to exchange data communications with one or more BMS devices controlled by the controller. Both the processor and memory are in communication with the wireless radio and located on the same chip as the wireless radio. The memory includes communication stacks configured to facilitate communications using a building automation and control network communications protocol and a Wi-Fi communications protocol. The integrated wireless network processor chip receives data from the BMS devices via the wireless radio, formats the data using the processor, stores the data in the memory, and sends the data via the wireless radio without requiring any additional processing or communications components outside the integrated wireless network processor chip.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/146,678, filed May 4, 2016, (now U.S. Pat. No. 10,484,478) whichclaims the benefit of and priority to U.S. Provisional PatentApplication No. 62/156,851, filed May 4, 2015 and is a continuation ofU.S. patent application Ser. No. 16/590,502, filed Oct. 2, 2019 which isa continuation of U.S. patent application Ser. No. 15/146,678, filed May4, 2016, (now U.S. Pat. No. 10,484,478) which claims the benefit of andpriority to U.S. Provisional Patent Application No. 62/156,851, filedMay 4, 2015, the entire contents each of which are incorporated byreference herein.

BACKGROUND

The present disclosure relates generally to building automation andcontrol networks. The present disclosure relates more particularly to acontroller in a building automation and control network with anintegrated wireless network processor chip.

In conventional building automation and control networks, a sensoractuator (SA) bus is typically used to exchange communications betweenBMS devices. The SA bus may include a communication trunk (e.g. RS-485circuitry) along with hardware associated with the communication trunk(e.g., level shifting hardware, end-of-line and address switches,insolated power supplies, wiring connectors, etc.). These components canincrease cost and add to the complexity of configuring the automationand control network. Other building automation and control networks addwireless connectivity to an existing network architecture. However, suchwireless connectivity is typically provided by an additional wirelesscommunications device or chip that is merely added to existingnetworking components.

SUMMARY

One implementation of the present disclosure is a controller in abuilding management system (BMS). The controller includes an integratedwireless network processor chip. The integrated wireless networkprocessor chip includes a wireless radio configured to exchange datacommunications with one or more BMS devices controlled by thecontroller. The integrated wireless network processor chip includes aprocessor in communication with the wireless radio and located on a samechip as the wireless radio. The integrated wireless network processorchip includes memory in communication with the wireless radio andlocated on the same chip as the wireless radio. The memory includescommunication stacks configured to facilitate communications using abuilding automation and control network communications protocol and aWi-Fi communications protocol. The integrated wireless network processorchip receives data from the BMS devices via the wireless radio, formatsthe data using the processor, stores the data in the memory, and sendsthe data via the wireless radio without requiring any additionalprocessing or communications components outside the integrated wirelessnetwork processor chip.

Another implementation includes a building management system. Thebuilding management system includes one or more HVAC devices, a userdevice, and an HVAC controller. The HVAC controller includes anintegrated wireless network processor chip. The integrated wirelessnetwork processor chip includes a wireless radio configured to exchangedata communications with one or more HVAC devices controlled by the HVACcontroller. The HVAC controller further includes a processor incommunication with the wireless radio and located on a same chip as thewireless radio, and a memory in communication with the wireless radioand located on the same chip as the wireless radio. The integratedwireless network process chip provides communication with the one ormore HVAC devices using a first communication protocol associated with afirst communication stack contained in the memory, and providescommunication with the user device using a second communication protocolassociated with a second communication stack contained in the memory.

Another implementation includes a method of communicating with aplurality of networks using an integrated wireless network processorchip. The method includes initializing the integrated wireless networkprocessor chip. The method further includes establishing a firstwireless network and a second wireless network using the integratedwireless network processor chip. The method also includes verifying anetwork connection of the integrated wireless network processor chip tothe first wireless network and the second wireless network. The methodfurther includes processing a first data request from the first wirelessnetwork and a second data request from the second wireless network, andupdating one or more parameters based on the processed first datarequest and the processed second data request.

Those skilled in the art will appreciate that the summary isillustrative only and is not intended to be in any way limiting. Otheraspects, inventive features, and advantages of the devices and/orprocesses described herein, as defined solely by the claims, will becomeapparent in the detailed description set forth herein and taken inconjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a building equipped with a HVAC system,according to one embodiment.

FIG. 2 is a schematic diagram of a waterside system which may be used inconjunction with the building of FIG. 1, according to one embodiment.

FIG. 3 is a schematic diagram of a waterside system which may be used inconjunction with the building of FIG. 1, according to one embodiment.

FIG. 4 is a block diagram of a building management system (BMS) whichmay be used in conjunction with the building of FIG. 1, according to oneembodiment.

FIG. 5 is a block diagram of a building automation and control networkwhich may be used in the BMS of FIG. 4, according to one embodiment.

FIGS. 6-9 are representations of user interfaces for modifying aparameter of a BMS device, according to one embodiment.

FIG. 10 is a block diagram of an integrated wireless network processorchip which may be used in the building automation and control network ofFIG. 5 to facilitate wireless communications and data processing withina single chip of a BMS device, according to one embodiment.

FIG. 11 is a representation of a user interface presented to a user in acloud based control system, according to one embodiment.

FIG. 12 is a block diagram illustrating a process for determining thelocation of a BMS device in a building automation and control networkusing wireless communications provided by the integrated wirelessnetwork processor chip of FIG. 6, according to an exemplary embodiment.

FIG. 13 is a block diagram illustrating a process for relaying data viaa mesh network of BMS devices equipped with the integrated wirelessnetwork processor chip of FIG. 6, according to an exemplary embodiment.

FIG. 14 is a flow chart illustrating a process for connecting anintegrated wireless network processor chip to one or more wirelessnetworks, according to one embodiment.

DETAILED DESCRIPTION

Referring generally to the FIGURES, a controller with an integratedwireless network processor chip is shown, according to an exemplaryembodiment. The integrated wireless network processor chip may beconfigured to facilitate wireless data communications between thecontroller and various devices monitored and/or controlled by thecontroller. In some embodiments, the data communications are BMScommunications such as sensor measurements (e.g., measured temperatures,pressures, voltages, etc.), feedback signals, control signals, or anyother type of communication between devices in a building automation andcontrol network. The controller may also communicate with a router, aBMS controller, a user device, and/or other types of systems or devicesusing the integrated wireless network processor chip. Advantageously,the controller uses the integrated wireless network processor chip tocommunicate with BMS devices without requiring hardware or support forconventional serial bus communications (i.e., without requiring a SAbus). In other embodiments, the controller includes an SA bus (e.g., tocommunicate with BMS devices) in addition to the wireless networkprocessor chip.

In some embodiments, the integrated wireless network processor chip is asingle-chip microcontroller unit with built-in wireless connectivity.The integrated wireless network processor chip may include both wirelesscommunications components (e.g., a WiFi radio, communications stacks, aWiFi driver, communications protocols, etc.) and data processingcomponents (e.g., a processor, memory, control logic, etc.). This allowsthe integrated wireless network processor chip to perform bothcommunications and control functions within the infrastructure of asingle chip without requiring any other communications or processingcomponents.

In some embodiments, the integrated wireless network processor chip isconfigured to communicate using a building automation system protocol.For example, the integrated wireless network processor chip may includea Building Automation and Control Networks (BACnet) stack that allowsthe integrated wireless network processor chip to communicate with BMSdevices using the BACnet communications protocol. In some embodiments,the integrated wireless network processor chip includes a JavaScriptObject Notation (JSON) stack that allows the integrated wireless networkprocessor chip to communicate with BMS devices using the JSONcommunications protocol. In various embodiments, the integrated wirelessnetwork processor chip may include any number or type of communicationsstacks (e.g., SSL, UDP, TCP, IP, 802.11, etc.) to allow the integratedwireless network processor chip to communicate using any of a variety ofwireless communications protocols. These and other features of thepresent invention are described in greater detail below.

Building Management System and HVAC System

Referring now to FIGS. 1-4, an exemplary building management system(BMS) and HVAC system in which the systems and methods of the presentinvention may be implemented are shown, according to an exemplaryembodiment. Referring particularly to FIG. 1, a perspective view of abuilding 10 is shown. Building 10 is served by a BMS. A BMS is, ingeneral, a system of devices configured to control, monitor, and manageequipment in or around a building or building area. A BMS can include,for example, a HVAC system, a security system, a lighting system, a firealerting system, any other system that is capable of managing buildingfunctions or devices, or any combination thereof.

The BMS that serves building 10 includes an HVAC system 100. HVAC system100 may include a plurality of HVAC devices (e.g., heaters, chillers,air handling units, pumps, fans, thermal energy storage, etc.)configured to provide heating, cooling, ventilation, or other servicesfor building 10. For example, HVAC system 100 is shown to include awaterside system 120 and an airside system 130. Waterside system 120 mayprovide a heated or chilled fluid to an air handling unit of airsidesystem 130. Airside system 130 may use the heated or chilled fluid toheat or cool an airflow provided to building 10. An exemplary watersidesystem and airside system which may be used in HVAC system 100 aredescribed in greater detail with reference to FIGS. 2-3.

HVAC system 100 is shown to include a chiller 102, a boiler 104, and arooftop air handling unit (AHU) 106. Waterside system 120 may use boiler104 and chiller 102 to heat or cool a working fluid (e.g., water,glycol, etc.) and may circulate the working fluid to AHU 106. In variousembodiments, the HVAC devices of waterside system 120 may be located inor around building 10 (as shown in FIG. 1) or at an offsite locationsuch as a central plant (e.g., a chiller plant, a steam plant, a heatplant, etc.). The working fluid may be heated in boiler 104 or cooled inchiller 102, depending on whether heating or cooling is required inbuilding 10. Boiler 104 may add heat to the circulated fluid, forexample, by burning a combustible material (e.g., natural gas) or usingan electric heating element. Chiller 102 may place the circulated fluidin a heat exchange relationship with another fluid (e.g., a refrigerant)in a heat exchanger (e.g., an evaporator) to absorb heat from thecirculated fluid. The working fluid from chiller 102 and/or boiler 104may be transported to AHU 106 via piping 108.

AHU 106 may place the working fluid in a heat exchange relationship withan airflow passing through AHU 106 (e.g., via one or more stages ofcooling coils and/or heating coils). The airflow may be, for example,outside air, return air from within building 10, or a combination ofboth. AHU 106 may transfer heat between the airflow and the workingfluid to provide heating or cooling for the airflow. For example, AHU106 may include one or more fans or blowers configured to pass theairflow over or through a heat exchanger containing the working fluid.The working fluid may then return to chiller 102 or boiler 104 viapiping 110.

Airside system 130 may deliver the airflow supplied by AHU 106 (i.e.,the supply airflow) to building 10 via air supply ducts 112 and mayprovide return air from building 10 to AHU 106 via air return ducts 114.In some embodiments, airside system 130 includes multiple variable airvolume (VAV) units 116. For example, airside system 130 is shown toinclude a separate VAV unit 116 on each floor or zone of building 10.VAV units 116 may include dampers or other flow control elements thatcan be operated to control an amount of the supply airflow provided toindividual zones of building 10. In other embodiments, airside system130 delivers the supply airflow into one or more zones of building 10(e.g., via supply ducts 112) without using intermediate VAV units 116 orother flow control elements. AHU 106 may include various sensors (e.g.,temperature sensors, pressure sensors, etc.) configured to measureattributes of the supply airflow. AHU 106 may receive input from sensorslocated within AHU 106 and/or within the building zone and may adjustthe flow rate, temperature, or other attributes of the supply airflowthrough AHU 106 to achieve setpoint conditions for the building zone.

Referring now to FIG. 2, a block diagram of a waterside system 200 isshown, according to an exemplary embodiment. In various embodiments,waterside system 200 may supplement or replace waterside system 120 inHVAC system 100 or may be implemented separate from HVAC system 100.When implemented in HVAC system 100, waterside system 200 may include asubset of the HVAC devices in HVAC system 100 (e.g., boiler 104, chiller102, pumps, valves, etc.) and may operate to supply a heated or chilledfluid to AHU 106. The HVAC devices of waterside system 200 may belocated within building 10 (e.g., as components of waterside system 120)or at an offsite location such as a central plant.

In FIG. 2, waterside system 200 is shown as a central plant having aplurality of subplants 202-212. Subplants 202-212 are shown to include aheater subplant 202, a heat recovery chiller subplant 204, a chillersubplant 206, a cooling tower subplant 208, a hot thermal energy storage(TES) subplant 210, and a cold thermal energy storage (TES) subplant212. Subplants 202-212 consume resources (e.g., water, natural gas,electricity, etc.) from utilities to serve the thermal energy loads(e.g., hot water, cold water, heating, cooling, etc.) of a building orcampus. For example, heater subplant 202 may be configured to heat waterin a hot water loop 214 that circulates the hot water between heatersubplant 202 and building 10. Chiller subplant 206 may be configured tochill water in a cold water loop 216 that circulates the cold waterbetween chiller subplant 206 building 10. Heat recovery chiller subplant204 may be configured to transfer heat from cold water loop 216 to hotwater loop 214 to provide additional heating for the hot water andadditional cooling for the cold water. Condenser water loop 218 mayabsorb heat from the cold water in chiller subplant 206 and reject theabsorbed heat in cooling tower subplant 208 or transfer the absorbedheat to hot water loop 214. Hot TES subplant 210 and cold TES subplant212 may store hot and cold thermal energy, respectively, for subsequentuse.

Hot water loop 214 and cold water loop 216 may deliver the heated and/orchilled water to air handlers located on the rooftop of building 10(e.g., AHU 106) or to individual floors or zones of building 10 (e.g.,VAV units 116). The air handlers push air past heat exchangers (e.g.,heating coils or cooling coils) through which the water flows to provideheating or cooling for the air. The heated or cooled air may bedelivered to individual zones of building 10 to serve the thermal energyloads of building 10. The water then returns to subplants 202-212 toreceive further heating or cooling.

Although subplants 202-212 are shown and described as heating andcooling water for circulation to a building, it is understood that anyother type of working fluid (e.g., glycol, CO2, etc.) may be used inplace of or in addition to water to serve the thermal energy loads. Inother embodiments, subplants 202-212 may provide heating and/or coolingdirectly to the building or campus without requiring an intermediateheat transfer fluid. These and other variations to waterside system 200are within the teachings of the present invention.

Each of subplants 202-212 may include a variety of equipment configuredto facilitate the functions of the subplant. For example, heatersubplant 202 is shown to include a plurality of heating elements 220(e.g., boilers, electric heaters, etc.) configured to add heat to thehot water in hot water loop 214. Heater subplant 202 is also shown toinclude several pumps 222 and 224 configured to circulate the hot waterin hot water loop 214 and to control the flow rate of the hot waterthrough individual heating elements 220. Chiller subplant 206 is shownto include a plurality of chillers 232 configured to remove heat fromthe cold water in cold water loop 216. Chiller subplant 206 is alsoshown to include several pumps 234 and 236 configured to circulate thecold water in cold water loop 216 and to control the flow rate of thecold water through individual chillers 232.

Heat recovery chiller subplant 204 is shown to include a plurality ofheat recovery heat exchangers 226 (e.g., refrigeration circuits)configured to transfer heat from cold water loop 216 to hot water loop214. Heat recovery chiller subplant 204 is also shown to include severalpumps 228 and 230 configured to circulate the hot water and/or coldwater through heat recovery heat exchangers 226 and to control the flowrate of the water through individual heat recovery heat exchangers 226.Cooling tower subplant 208 is shown to include a plurality of coolingtowers 238 configured to remove heat from the condenser water incondenser water loop 218. Cooling tower subplant 208 is also shown toinclude several pumps 240 configured to circulate the condenser water incondenser water loop 218 and to control the flow rate of the condenserwater through individual cooling towers 238.

Hot TES subplant 210 is shown to include a hot TES tank 242 configuredto store the hot water for later use. Hot TES subplant 210 may alsoinclude one or more pumps or valves configured to control the flow rateof the hot water into or out of hot TES tank 242. Cold TES subplant 212is shown to include cold TES tanks 244 configured to store the coldwater for later use. Cold TES subplant 212 may also include one or morepumps or valves configured to control the flow rate of the cold waterinto or out of cold TES tanks 244.

In some embodiments, one or more of the pumps in waterside system 200(e.g., pumps 222, 224, 228, 230, 234, 236, and/or 240) or pipelines inwaterside system 200 include an isolation valve associated therewith.Isolation valves may be integrated with the pumps or positioned upstreamor downstream of the pumps to control the fluid flows in watersidesystem 200. In various embodiments, waterside system 200 may includemore, fewer, or different types of devices and/or subplants based on theparticular configuration of waterside system 200 and the types of loadsserved by waterside system 200.

Referring now to FIG. 3, a block diagram of an airside system 300 isshown, according to an exemplary embodiment. In various embodiments,airside system 300 may supplement or replace airside system 130 in HVACsystem 100 or may be implemented separate from HVAC system 100. Whenimplemented in HVAC system 100, airside system 300 may include a subsetof the HVAC devices in HVAC system 100 (e.g., AHU 106, VAV units 116,ducts 112-114, fans, dampers, etc.) and may be located in or aroundbuilding 10. Airside system 300 may operate to heat or cool an airflowprovided to building 10 using a heated or chilled fluid provided bywaterside system 200.

In FIG. 3, airside system 300 is shown to include an economizer-type airhandling unit (AHU) 302. Economizer-type AHUs vary the amount of outsideair and return air used by the air handling unit for heating or cooling.For example, AHU 302 may receive return air 304 from building zone 306via return air duct 308 and may deliver supply air 310 to building zone306 via supply air duct 312. In some embodiments, AHU 302 is a rooftopunit located on the roof of building 10 (e.g., AHU 106 as shown inFIG. 1) or otherwise positioned to receive both return air 304 andoutside air 314. AHU 302 may be configured to operate exhaust air damper316, mixing damper 318, and outside air damper 320 to control an amountof outside air 314 and return air 304 that combine to form supply air310. Any return air 304 that does not pass through mixing damper 318 maybe exhausted from AHU 302 through exhaust damper 316 as exhaust air 322.

Each of dampers 316-320 may be operated by an actuator. For example,exhaust air damper 316 may be operated by actuator 324, mixing damper318 may be operated by actuator 326, and outside air damper 320 may beoperated by actuator 328. Actuators 324-328 may communicate with an AHUcontroller 330 via a communications link 332. Actuators 324-328 mayreceive control signals from AHU controller 330 and may provide feedbacksignals to AHU controller 330. Feedback signals may include, forexample, an indication of a current actuator or damper position, anamount of torque or force exerted by the actuator, diagnosticinformation (e.g., results of diagnostic tests performed by actuators324-328), status information, commissioning information, configurationsettings, calibration data, and/or other types of information or datathat may be collected, stored, or used by actuators 324-328. AHUcontroller 330 may be an economizer controller configured to use one ormore control algorithms (e.g., state-based algorithms, extremum seekingcontrol (ESC) algorithms, proportional-integral (PI) control algorithms,proportional-integral-derivative (PID) control algorithms, modelpredictive control (MPC) algorithms, feedback control algorithms, etc.)to control actuators 324-328.

Still referring to FIG. 3, AHU 302 is shown to include a cooling coil334, a heating coil 336, and a fan 338 positioned within supply air duct312. Fan 338 may be configured to force supply air 310 through coolingcoil 334 and/or heating coil 336 and provide supply air 310 to buildingzone 306. AHU controller 330 may communicate with fan 338 viacommunications link 340 to control a flow rate of supply air 310. Insome embodiments, AHU controller 330 controls an amount of heating orcooling applied to supply air 310 by modulating a speed of fan 338.

Cooling coil 334 may receive a chilled fluid from waterside system 200(e.g., from cold water loop 216) via piping 342 and may return thechilled fluid to waterside system 200 via piping 344. Valve 346 may bepositioned along piping 342 or piping 344 to control a flow rate of thechilled fluid through cooling coil 334. In some embodiments, coolingcoil 334 includes multiple stages of cooling coils that can beindependently activated and deactivated (e.g., by AHU controller 330, byBMS controller 366, etc.) to modulate an amount of cooling applied tosupply air 310.

Heating coil 336 may receive a heated fluid from waterside system 200(e.g., from hot water loop 214) via piping 348 and may return the heatedfluid to waterside system 200 via piping 350. Valve 352 may bepositioned along piping 348 or piping 350 to control a flow rate of theheated fluid through heating coil 336. In some embodiments, heating coil336 includes multiple stages of heating coils that can be independentlyactivated and deactivated (e.g., by AHU controller 330, by BMScontroller 366, etc.) to modulate an amount of heating applied to supplyair 310.

Each of valves 346 and 352 may be controlled by an actuator. Forexample, valve 346 may be controlled by actuator 354 and valve 352 maybe controlled by actuator 356. Actuators 354-356 may communicate withAHU controller 330 via communications links 358-360. Actuators 354-356may receive control signals from AHU controller 330 and may providefeedback signals to controller 330. In some embodiments, AHU controller330 receives a measurement of the supply air temperature from atemperature sensor 362 positioned in supply air duct 312 (e.g.,downstream of cooling coil 334 and/or heating coil 336). AHU controller330 may also receive a measurement of the temperature of building zone306 from a temperature sensor 364 located in building zone 306.

In some embodiments, AHU controller 330 operates valves 346 and 352 viaactuators 354-356 to modulate an amount of heating or cooling providedto supply air 310 (e.g., to achieve a setpoint temperature for supplyair 310 or to maintain the temperature of supply air 310 within asetpoint temperature range). The positions of valves 346 and 352 affectthe amount of heating or cooling provided to supply air 310 by coolingcoil 334 or heating coil 336 and may correlate with the amount of energyconsumed to achieve a desired supply air temperature. AHU 330 maycontrol the temperature of supply air 310 and/or building zone 306 byactivating or deactivating coils 334-336, adjusting a speed of fan 338,or a combination of both.

Still referring to FIG. 3, airside system 300 is shown to include abuilding management system (BMS) controller 366 and a client device 368.BMS controller 366 may include one or more computer systems (e.g.,servers, supervisory controllers, subsystem controllers, etc.) thatserve as system level controllers, application or data servers, headnodes, or master controllers for airside system 300, waterside system200, HVAC system 100, and/or other controllable systems that servebuilding 10. BMS controller 366 may communicate with multiple downstreambuilding systems or subsystems (e.g., HVAC system 100, a securitysystem, a lighting system, waterside system 200, etc.) via acommunications link 370 according to like or disparate protocols (e.g.,LON, BACnet, etc.). In various embodiments, AHU controller 330 and BMScontroller 366 may be separate (as shown in FIG. 3) or integrated. In anintegrated implementation, AHU controller 330 may be a software moduleconfigured for execution by a processor of BMS controller 366.

In some embodiments, AHU controller 330 receives information from BMScontroller 366 (e.g., commands, setpoints, operating boundaries, etc.)and provides information to BMS controller 366 (e.g., temperaturemeasurements, valve or actuator positions, operating statuses,diagnostics, etc.). For example, AHU controller 330 may provide BMScontroller 366 with temperature measurements from temperature sensors362-364, equipment on/off states, equipment operating capacities, and/orany other information that can be used by BMS controller 366 to monitoror control a variable state or condition within building zone 306.

Client device 368 may include one or more human-machine interfaces orclient interfaces (e.g., graphical user interfaces, reportinginterfaces, text-based computer interfaces, client-facing web services,web servers that provide pages to web clients, etc.) for controlling,viewing, or otherwise interacting with HVAC system 100, its subsystems,and/or devices. Client device 368 may be a computer workstation, aclient terminal, a remote or local interface, or any other type of userinterface device. Client device 368 may be a stationary terminal or amobile device. For example, client device 368 may be a desktop computer,a computer server with a user interface, a laptop computer, a tablet, asmartphone, a PDA, or any other type of mobile or non-mobile device.Client device 368 may communicate with BMS controller 366 and/or AHUcontroller 330 via communications link 372.

Referring now to FIG. 4, a block diagram of a building management system(BMS) 400 is shown, according to an exemplary embodiment. BMS 400 may beimplemented in building 10 to automatically monitor and control variousbuilding functions. BMS 400 is shown to include BMS controller 366 and aplurality of building subsystems 428. Building subsystems 428 are shownto include a building electrical subsystem 434, an informationcommunication technology (ICT) subsystem 436, a security subsystem 438,a HVAC subsystem 440, a lighting subsystem 442, a lift/escalatorssubsystem 432, and a fire safety subsystem 430. In various embodiments,building subsystems 428 can include fewer, additional, or alternativesubsystems. For example, building subsystems 428 may also oralternatively include a refrigeration subsystem, an advertising orsignage subsystem, a cooking subsystem, a vending subsystem, a printeror copy service subsystem, or any other type of building subsystem thatuses controllable equipment and/or sensors to monitor or controlbuilding 10. In some embodiments, building subsystems 428 includewaterside system 200 and/or airside system 300, as described withreference to FIGS. 2-3.

Each of building subsystems 428 may include any number of devices,controllers, and connections for completing its individual functions andcontrol activities. HVAC subsystem 440 may include many of the samecomponents as HVAC system 100, as described with reference to FIGS. 1-3.For example, HVAC subsystem 440 may include a chiller, a boiler, anynumber of air handling units, economizers, field controllers,supervisory controllers, actuators, temperature sensors, and otherdevices for controlling the temperature, humidity, airflow, or othervariable conditions within building 10. Lighting subsystem 442 mayinclude any number of light fixtures, ballasts, lighting sensors,dimmers, or other devices configured to controllably adjust the amountof light provided to a building space. Security subsystem 438 mayinclude occupancy sensors, video surveillance cameras, digital videorecorders, video processing servers, intrusion detection devices, accesscontrol devices and servers, or other security-related devices.

Still referring to FIG. 4, BMS controller 366 is shown to include acommunications interface 407 and a BMS interface 409. Interface 407 mayfacilitate communications between BMS controller 366 and externalapplications (e.g., monitoring and reporting applications 422,enterprise control applications 426, remote systems and applications444, applications residing on client devices 448, etc.) for allowinguser control, monitoring, and adjustment to BMS controller 366 and/orsubsystems 428. Interface 407 may also facilitate communications betweenBMS controller 366 and client devices 448. BMS interface 409 mayfacilitate communications between BMS controller 366 and buildingsubsystems 428 (e.g., HVAC, lighting security, lifts, powerdistribution, business, etc.).

Interfaces 407, 409 can be or include wired or wireless communicationsinterfaces (e.g., jacks, antennas, transmitters, receivers,transceivers, wire terminals, etc.) for conducting data communicationswith building subsystems 428 or other external systems or devices. Invarious embodiments, communications via interfaces 407, 409 may bedirect (e.g., local wired or wireless communications) or via acommunications network 446 (e.g., a WAN, the Internet, a cellularnetwork, etc.). For example, interfaces 407, 409 can include an Ethernetcard and port for sending and receiving data via an Ethernet-basedcommunications link or network. In another example, interfaces 407, 409can include a WiFi transceiver for communicating via a wirelesscommunications network. In another example, one or both of interfaces407, 409 may include cellular or mobile phone communicationstransceivers. In one embodiment, communications interface 407 is a powerline communications interface and BMS interface 409 is an Ethernetinterface. In other embodiments, both communications interface 407 andBMS interface 409 are Ethernet interfaces or are the same Ethernetinterface.

Still referring to FIG. 4, BMS controller 366 is shown to include aprocessing circuit 404 including a processor 406 and memory 408.Processing circuit 404 may be communicably connected to BMS interface409 and/or communications interface 407 such that processing circuit 404and the various components thereof can send and receive data viainterfaces 407, 409. Processor 406 can be implemented as a generalpurpose processor, an application specific integrated circuit (ASIC),one or more field programmable gate arrays (FPGAs), a group ofprocessing components, or other suitable electronic processingcomponents.

Memory 408 (e.g., memory, memory unit, storage device, etc.) may includeone or more devices (e.g., RAM, ROM, Flash memory, hard disk storage,etc.) for storing data and/or computer code for completing orfacilitating the various processes, layers and modules described in thepresent application. Memory 408 may be or include volatile memory ornon-volatile memory. Memory 408 may include database components, objectcode components, script components, or any other type of informationstructure for supporting the various activities and informationstructures described in the present application. According to anexemplary embodiment, memory 408 is communicably connected to processor406 via processing circuit 404 and includes computer code for executing(e.g., by processing circuit 404 and/or processor 406) one or moreprocesses described herein.

In some embodiments, BMS controller 366 is implemented within a singlecomputer (e.g., one server, one housing, etc.). In various otherembodiments BMS controller 366 may be distributed across multipleservers or computers (e.g., that can exist in distributed locations).Further, while FIG. 4 shows applications 422 and 426 as existing outsideof BMS controller 366, in some embodiments, applications 422 and 426 maybe hosted within BMS controller 366 (e.g., within memory 408).

Still referring to FIG. 4, memory 408 is shown to include an enterpriseintegration layer 410, an automated measurement and validation (AM&V)layer 412, a demand response (DR) layer 414, a fault detection anddiagnostics (FDD) layer 416, an integrated control layer 418, and abuilding subsystem integration later 420. Layers 410-420 may beconfigured to receive inputs from building subsystems 428 and other datasources, determine optimal control actions for building subsystems 428based on the inputs, generate control signals based on the optimalcontrol actions, and provide the generated control signals to buildingsubsystems 428. The following paragraphs describe some of the generalfunctions performed by each of layers 410-420 in BMS 400.

Enterprise integration layer 410 may be configured to serve clients orlocal applications with information and services to support a variety ofenterprise-level applications. For example, enterprise controlapplications 426 may be configured to provide subsystem-spanning controlto a graphical user interface (GUI) or to any number of enterprise-levelbusiness applications (e.g., accounting systems, user identificationsystems, etc.). Enterprise control applications 426 may also oralternatively be configured to provide configuration GUIs forconfiguring BMS controller 366. In yet other embodiments, enterprisecontrol applications 426 can work with layers 410-420 to optimizebuilding performance (e.g., efficiency, energy use, comfort, or safety)based on inputs received at interface 407 and/or BMS interface 409.

Building subsystem integration layer 420 may be configured to managecommunications between BMS controller 366 and building subsystems 428.For example, building subsystem integration layer 420 may receive sensordata and input signals from building subsystems 428 and provide outputdata and control signals to building subsystems 428. Building subsystemintegration layer 420 may also be configured to manage communicationsbetween building subsystems 428. Building subsystem integration layer420 translate communications (e.g., sensor data, input signals, outputsignals, etc.) across a plurality of multi-vendor/multi-protocolsystems.

Demand response layer 414 may be configured to optimize resource usage(e.g., electricity use, natural gas use, water use, etc.) and/or themonetary cost of such resource usage in response to satisfy the demandof building 10. The optimization may be based on time-of-use prices,curtailment signals, energy availability, or other data received fromutility providers, distributed energy generation systems 424, fromenergy storage 427 (e.g., hot TES 242, cold TES 244, etc.), or fromother sources. Demand response layer 414 may receive inputs from otherlayers of BMS controller 366 (e.g., building subsystem integration layer420, integrated control layer 418, etc.). The inputs received from otherlayers may include environmental or sensor inputs such as temperature,carbon dioxide levels, relative humidity levels, air quality sensoroutputs, occupancy sensor outputs, room schedules, and the like. Theinputs may also include inputs such as electrical use (e.g., expressedin kWh), thermal load measurements, pricing information, projectedpricing, smoothed pricing, curtailment signals from utilities, and thelike.

According to an exemplary embodiment, demand response layer 414 includescontrol logic for responding to the data and signals it receives. Theseresponses can include communicating with the control algorithms inintegrated control layer 418, changing control strategies, changingsetpoints, or activating/deactivating building equipment or subsystemsin a controlled manner. Demand response layer 414 may also includecontrol logic configured to determine when to utilize stored energy. Forexample, demand response layer 414 may determine to begin using energyfrom energy storage 427 just prior to the beginning of a peak use hour.

In some embodiments, demand response layer 414 includes a control moduleconfigured to actively initiate control actions (e.g., automaticallychanging setpoints) which minimize energy costs based on one or moreinputs representative of or based on demand (e.g., price, a curtailmentsignal, a demand level, etc.). In some embodiments, demand responselayer 414 uses equipment models to determine an optimal set of controlactions. The equipment models may include, for example, thermodynamicmodels describing the inputs, outputs, and/or functions performed byvarious sets of building equipment. Equipment models may representcollections of building equipment (e.g., subplants, chiller arrays,etc.) or individual devices (e.g., individual chillers, heaters, pumps,etc.).

Demand response layer 414 may further include or draw upon one or moredemand response policy definitions (e.g., databases XML files, etc.).The policy definitions may be edited or adjusted by a user (e.g., via agraphical user interface) so that the control actions initiated inresponse to demand inputs may be tailored for the user's application,desired comfort level, particular building equipment, or based on otherconcerns. For example, the demand response policy definitions canspecify which equipment may be turned on or off in response toparticular demand inputs, how long a system or piece of equipment shouldbe turned off, what setpoints can be changed, what the allowable setpoint adjustment range is, how long to hold a high demand setpointbefore returning to a normally scheduled setpoint, how close to approachcapacity limits, which equipment modes to utilize, the energy transferrates (e.g., the maximum rate, an alarm rate, other rate boundaryinformation, etc.) into and out of energy storage devices (e.g., thermalstorage tanks, battery banks, etc.), and when to dispatch on-sitegeneration of energy (e.g., via fuel cells, a motor generator set,etc.).

Integrated control layer 418 may be configured to use the data input oroutput of building subsystem integration layer 420 and/or demandresponse later 414 to make control decisions. Due to the subsystemintegration provided by building subsystem integration layer 420,integrated control layer 418 can integrate control activities of thesubsystems 428 such that the subsystems 428 behave as a singleintegrated supersystem. In an exemplary embodiment, integrated controllayer 418 includes control logic that uses inputs and outputs from aplurality of building subsystems to provide greater comfort and energysavings relative to the comfort and energy savings that separatesubsystems could provide alone. For example, integrated control layer418 may be configured to use an input from a first subsystem to make anenergy-saving control decision for a second subsystem. Results of thesedecisions can be communicated back to building subsystem integrationlayer 420.

Integrated control layer 418 is shown to be logically below demandresponse layer 414. Integrated control layer 418 may be configured toenhance the effectiveness of demand response layer 414 by enablingbuilding subsystems 428 and their respective control loops to becontrolled in coordination with demand response layer 414. Thisconfiguration may advantageously reduce disruptive demand responsebehavior relative to conventional systems. For example, integratedcontrol layer 418 may be configured to assure that a demandresponse-driven upward adjustment to the setpoint for chilled watertemperature (or another component that directly or indirectly affectstemperature) does not result in an increase in fan energy (or otherenergy used to cool a space) that would result in greater total buildingenergy use than was saved at the chiller.

Integrated control layer 418 may be configured to provide feedback todemand response layer 414 so that demand response layer 414 checks thatconstraints (e.g., temperature, lighting levels, etc.) are properlymaintained even while demanded load shedding is in progress. Theconstraints may also include setpoint or sensed boundaries relating tosafety, equipment operating limits and performance, comfort, fire codes,electrical codes, energy codes, and the like. Integrated control layer418 is also logically below fault detection and diagnostics layer 416and automated measurement and validation layer 412. Integrated controllayer 418 may be configured to provide calculated inputs (e.g.,aggregations) to these higher levels based on outputs from more than onebuilding subsystem.

Automated measurement and validation (AM&V) layer 412 may be configuredto verify that control strategies commanded by integrated control layer418 or demand response layer 414 are working properly (e.g., using dataaggregated by AM&V layer 412, integrated control layer 418, buildingsubsystem integration layer 420, FDD layer 416, or otherwise). Thecalculations made by AM&V layer 412 may be based on building systemenergy models and/or equipment models for individual BMS devices orsubsystems. For example, AM&V layer 412 may compare a model-predictedoutput with an actual output from building subsystems 428 to determinean accuracy of the model.

Fault detection and diagnostics (FDD) layer 416 may be configured toprovide on-going fault detection for building subsystems 428, buildingsubsystem devices (i.e., building equipment), and control algorithmsused by demand response layer 414 and integrated control layer 418. FDDlayer 416 may receive data inputs from integrated control layer 418,directly from one or more building subsystems or devices, or fromanother data source. FDD layer 416 may automatically diagnose andrespond to detected faults. The responses to detected or diagnosedfaults may include providing an alert message to a user, a maintenancescheduling system, or a control algorithm configured to attempt torepair the fault or to work-around the fault.

FDD layer 416 may be configured to output a specific identification ofthe faulty component or cause of the fault (e.g., loose damper linkage)using detailed subsystem inputs available at building subsystemintegration layer 420. In other exemplary embodiments, FDD layer 416 isconfigured to provide “fault” events to integrated control layer 418which executes control strategies and policies in response to thereceived fault events. According to an exemplary embodiment, FDD layer416 (or a policy executed by an integrated control engine or businessrules engine) may shut-down systems or direct control activities aroundfaulty devices or systems to reduce energy waste, extend equipment life,or assure proper control response.

FDD layer 416 may be configured to store or access a variety ofdifferent system data stores (or data points for live data). FDD layer416 may use some content of the data stores to identify faults at theequipment level (e.g., specific chiller, specific AHU, specific terminalunit, etc.) and other content to identify faults at component orsubsystem levels. For example, building subsystems 428 may generatetemporal (i.e., time-series) data indicating the performance of BMS 400and the various components thereof. The data generated by buildingsubsystems 428 may include measured or calculated values that exhibitstatistical characteristics and provide information about how thecorresponding system or process (e.g., a temperature control process, aflow control process, etc.) is performing in terms of error from itssetpoint. These processes can be examined by FDD layer 416 to exposewhen the system begins to degrade in performance and alert a user torepair the fault before it becomes more severe.

Controller with Integrated Wireless Network Processor Chip

Referring now to FIG. 5, a block diagram of a building automation andcontrol network 500 is shown, according to one embodiment. Network 500may be implemented as a component of a BMS (e.g., BMS 400) to facilitatecommunications between various devices of the BMS (e.g., controllers,building equipment, building subsystems, etc.).

Network 500 is shown to include a device controller 502. In someembodiments, the device controller 502 is a controller for HVACequipment (e.g., a chiller controller, an AHU controller, a subplantcontroller, etc.). Although the present invention is described primarilywith respect to HVAC devices, it should be understood that the systemsand methods described herein can be used in conjunction with any type ofequipment or device. For example, the device controller 502 may be acontroller for any type of controllable system or device (e.g., HVACequipment, lighting equipment, security equipment, electrical equipment,etc.).

The device controller 502 is shown to include an integrated wirelessnetwork processor chip 504. The integrated wireless network processorchip 504 may be configured to facilitate wireless data communicationsbetween the device controller 502 and various devices monitored and/orcontrolled by the device controller. For example, the device controller502 is shown communicating wirelessly with a sensor 506, an actuator508, an HVAC device 510, and a BMS device 512. Throughout thisdisclosure, the devices with which the device controller 502communicates are referred to collectively as “BMS devices” 514. Thedevice controller 502 may exchange data communications with these andother types of BMS devices 514 via the integrated wireless networkprocessor chip 504. In some embodiments, the data communications are BMScommunications such as sensor measurements (e.g., measured temperatures,pressures, voltages, etc.), feedback signals, control signals, or anyother type of communication between devices in a building automation andcontrol network. The device controller 502 may also communicate with arouter 516, a BMS controller 518, one or more user devices 520, 522,and/or other types of systems or devices using the integrated wirelessnetwork processor chip 504.

In conventional building automation and control networks, a sensoractuator (SA) bus is used to exchange communications between BMS devices514. The SA bus may include a communication trunk (e.g. RS-485circuitry) along with hardware associated with the communication trunk(e.g., level shifting hardware, end-of-line and address switches,insolated power supplies, wiring connectors, etc.). These components canincrease cost and add to the complexity of configuring the automationand control network. Other building automation and control networks addwireless connectivity to an existing network architecture. However, suchwireless connectivity is typically provided by an additional wirelesscommunications device or chip that is merely added to existingnetworking components. Advantageously, the device controller 502 shownin FIG. 5 uses the integrated wireless network processor chip 504 tocommunicate with BMS devices 514 without requiring hardware or supportfor conventional serial bus communications (i.e., without requiring a SAbus).

It is contemplated that the device controller 502 shown in FIG. 5 caninclude an SA bus 524 in addition to the integrated wireless networkprocessor chip 504 in various other embodiments. The SA bus 524 may beused by the device controller 502 to communicate with the BMS devices514 (e.g., using a BACnet or JSON communications protocol). Theintegrated wireless network processor chip 504 may receive data via theSA bus 524 and transmit the data to other systems or devices wirelessly,such as the BMS controller 518 or the user devices 522, 524. In someembodiments, the SA bus 524 is combined with the integrated wirelessnetwork processor chip 504. For example, the integrated wireless networkprocessor chip 504 may include both a wireless radio 528 and an SA busdriver 530 for conducting both wired and wireless data communications.

In some embodiments, the integrated wireless network processor chip 504is a single-chip microcontroller unit with built-in wirelessconnectivity. For example, the integrated wireless network processorchip 504 may be a SIMPLELINK brand microcontroller unit, as sold byTexas Instruments (e.g., model number CC2630, CC3200, or the like). Theintegrated wireless network processor chip 504 may include both wirelesscommunications components (e.g., a WiFi radio, communications stacks, aWiFi driver, communications protocols, etc.) and data processingcomponents (e.g., a processor, memory, control logic, etc.). This allowsthe integrated wireless network processor chip 504 to perform bothcommunications and control functions within the infrastructure of asingle chip without requiring any other communications or processingcomponents.

In some embodiments, the integrated wireless network processor chip 504is configured to communicate using a building automation systemprotocol. For example, the integrated wireless network processor chip504 may include a Building Automation and Control Networks (BACnet)stack that allows the integrated wireless network processor chip 504 tocommunicate with BMS devices 514 using the BACnet communicationsprotocol. In some embodiments, the integrated wireless network processorchip 504 includes a JavaScript Object Notation (JSON) stack that allowsthe integrated wireless network processor chip 504 to communicate withBMS devices 514 using the JSON communications protocol. In variousembodiments, the integrated wireless network processor chip 504 mayinclude any number or type of communications stacks (e.g., SSL, UDP,TCP, IP, 802.11, etc.) to allow the integrated wireless networkprocessor chip 504 to communicate using any of a variety of wirelesscommunications protocols.

Still referring to FIG. 5, the device controller 502 may be configuredto receive data from the BMS devices 514 (e.g., sensors, actuators, HVACdevices, etc.) via the wireless radio 528 of the integrated wirelessnetwork processor chip 504. The integrated wireless network processorchip 504 may use an integrated processor (i.e., within the integratedwireless network processor chip 504) to format the data and store thedata within a memory of the integrated wireless network processor chip504. The integrated wireless network processor chip 504 may beconfigured to wrap the data in a Wi-Fi protocol and send the data to oneor more of the user devices 522, 524, the router 516, or another systemor device via the wireless radio 528. Advantageously, the data from theBMS devices 514 can be received, processed, stored, formatted, andcommunicated to another system or device using only the integratedwireless network processor chip 504 (i.e., without requiring an externalprocessor, memory, or any other component outside the integratedwireless network processor chip). In one embodiment, some or all of theBMS devices 514 include an integrated wireless radio for communicationto the device controller 502 using the integrated wireless networkprocessor chip 504. The integrated wireless radios can be Wi-Fi, Zigbee,Bluetooth, LoRa, etc. In one example, the BMS devices 514 may includewireless radios for communication directly with the integrated wirelessnetwork processor chip 504. The BMS devices 514 may include anintegrated wireless network processor chip, similar to integratedwireless network processor chip 504, discussed above.

In one embodiment, one or more of the user devices 522, 524 are mobiledevices. Mobile devices can include smartphones, tablets, laptops, smartwatches, or other wireless devices having wireless communicationcapabilities. In one embodiment, the user devices 522, 524 communicatedirectly with the device controller 502, via the integrated wirelessnetwork processor chip 504. This can allow a user of the user device522, 524 to access the BMS devices 514 directly from their user device522, 524. In one example, a user may be able to access sensor data fromthe sensor device 506 on their user device 522, 524 via wirelesscommunication with the user device controller 502. Additionally, theuser device 522, 524 may be able to provide access to setpoints, statusinformation, device ID's, or other applicable data associated with oneor more of the BMS devices 514. Furthermore, in some embodiments, theuser device 522, 524 allows for modification of parameters and/orsetpoints of the BMS devices 514. Additionally, if the device controller502 is coupled to an SA bus, the user device 522, 524 can access all BMSdevices 514 coupled to the SA bus 524. This can allow the user device522, 524 direct access to a JSON or BACnet backbone via the integratedwireless network processor chip 504 on the device controller 502. In oneembodiment, the user device 522, 524 is configured to access and controlone or more of the BMS devices 514 using an application installed on theuser device 522, 524 which provides a user interface for reading andwriting to the BMS devices 514 and/or device controller 502.

Referring now to FIGS. 6-9, several exemplary user interfaces that canbe presented via a display of a user device, such as user devices 522,524 described above, are shown, according to one embodiment. In someembodiments, these interfaces are generated by an application running onthe user device. In other embodiments, the interfaces are generated bythe device controller 502 and/or the BMS controller 518.

Referring particularly to FIG. 6, a user interface 600 for modifying aparameter of a BMS device is shown, according to one embodiment. The BMSdevice may be an HVAC device such as a VAV or an AHU device, asdescribed above. However, it is contemplated that the BMS device can beany device associated with a given building management system. The userinterface 600 can display multiple parameters at one time. For example,user interface 600 can display a temperature parameter 602, a humidityparameter 604, a fan speed parameter 606, a damper position parameter608, a compressor parameter 610, and an alarm parameter 612. However, itis contemplated that the user interface 600 may be used to modify and/orview any parameter associated with a particular BMS device. Someparameters may be read only, such as the temperature parameter 602and/or the humidity parameter 604, which may display current sensedparameters (i.e. temperature and/or humidity). Other parameters may beread/write parameters, thereby allowing a user to modify the read/writeparameters via the user interface 600. As shown in FIG. 6, read/writeparameters can include the fan speed parameter 606, the damper positionparameter 608, the compressor parameter 610, and the alarm parameter612.

Referring to FIG. 7, a parameter input dialog box 702 is shown on userinterface 600. Parameter input dialog box 702 can allow a user to inputa desired parameter value using input device 704. While input device 704is shown as a number of variable or “soft keys” displayed and accessibleon the user interface 600, it is contemplated that the input device 704can be an external device such as a keyboard or a keypad. In oneembodiment, the type of input value can be defined based on the type ofparameter. For example, parameter input dialog box 702 shows a numericalvalue being input for the fan speed parameter 606. The input type can bedefined such that a numerical value, such as “100” can be defined tomean a percentage of a maximum fan speed value (i.e. 100%). In otherexamples, the input type can be defined to mean an RPM value (i.e. 100RPM). In some embodiment, the input type is defined by a BMS controller.Alternatively, the input type can be defined by a device controller(e.g. device controller 502 in FIG. 5), or the BMS device itself.

Referring now to AG. 8, a further parameter input dialog box 800 can beseen. Parameter input dialog box 800 can be allowed for a discreteselection of a given parameter. For example, parameter input dialog box800 is shown as requiring a parameter value of “True” or “False” to beselected for the compressor parameter 610. As stated above, the inputtype (e.g. “true” or “false”) can be defined by a BMS controller, adevice controller or a BMS device. Referring now to FIG. 9, a furtherparameter dialog box 900 can be seen. Parameter dialog box 900 candisplay an IP device of the BMS device. In some embodiment, parameterdialog box 900 can be an input dialog box, thereby allowing a user tomodify the device IP address via the user interface 600.

Referring now to FIG. 10, a block diagram illustrating an integratedwireless network processor circuit 1000 in greater detail is shown,according to one embodiment. The integrated wireless network processorcircuit 1000 is shown to include a processing circuit 1002 and awireless radio 1004. In some embodiments, the wireless radio is an802.11 b/g/n WiFi radio. In other embodiments the wireless radio 1004can be a Zigbee radio, a Bluetooth radio, a cellular radio (3G, 4G, LTE,CDMA, etc.) a near field communication (NFC) radio, a LoRa RF radio,etc. The processing circuit 1002 may be communicably connected to thewireless radio 1004 such that the processing circuit 1002 and thevarious components thereof can send and receive data via the wirelessradio 1004. In one embodiment, the processing circuit 1002 includes aprocessor 1006 and a memory 1008. The processor 1006 can be implementedas a general purpose processor, an application specific integratedcircuit (ASIC), one or more field programmable gate arrays (FPGAs), agroup of processing components, or other suitable electronic processingcomponents. In some embodiments, the processor 1006 is an ARMmicrocontroller unit (MCU).

The memory 1008 (e.g., memory, memory unit, storage device, etc.) mayinclude one or more devices (e.g., RAM, ROM, Flash memory, etc.) forstring data and/or computer code for completing or facilitating thevarious processes, layers and modules described in the presentapplication. The memory 1008 may be or include volatile memory ornon-volatile memory. The memory 1008 may include database components,object code components, script components, or any other type ofinformation structure for supporting the various activities andinformation structures described in the present application. Accordingto an exemplary embodiment, the memory 1008 is communicably connected tothe processor 1006 via the processing circuit 1002 and includes computercode for executing (e.g., by the processing circuit and/or theprocessor) one or more processes described herein.

The integrated wireless network processor chip 1002 is shown to includea communications module 1010. The communications module 1010 may allowthe integrated wireless network processor chip 1000 to communicate usingany of a variety of communications protocols. In one embodiment, thecommunications module 1010 includes a number of applicationprotocols/stacks in an application protocol module 1012. The applicationprotocol module 1012 include a BACnet communication stack 1014, aJavaScript Object Notation (JSON) communication stack 1016, and a Zigbeecommunication stack 1018. Other possible communication protocols/stackscan include NFC communication stacks, Bluetooth communication stacks,LoRa communication stacks and/or any other wireless communicationsprotocol. The BACnet communication stack can support standard BACnetUDP/IP wireless communications. Further, the BACnet communication stackcan utilize standard BACnet IP messaging, allowing for BMS controllersand devices to discover, monitor, and control other I/O points on theBACnet network. Further, the BACnet communication stack 1014 can mapphysical I/O points associated with a device in communication with theintegrated wireless network processor circuit 1000 (e.g. devicecontroller 502 of FIG. 5). The BACnet communication stack 1014 canprovide for wireless UPD/IP communication to BACnet connected devicesvia the integrated wireless network processor circuit 1000, as discussedbelow.

In one embodiment, the JSON communication stack 1016 supports theinternet-of-things (IoT) RESTful JSON HTTP(s) TCP/IP wirelesscommunication. This can allow for mobile devices, such as smart phones(iPhone, Android phone, Windows phone, etc.), tablet computers (iPad,Microsoft Surface, etc) or other mobile devices with wirelesscommunication capability to communicate with the BMS. Further, using theJSON communication stack in combination with the integrated wirelessnetwork processor circuit 1000, can allow a user to commission and/ordiagnose BMS devices through the integrated wireless network processorcircuit 1000. For example, a device controller (e.g. device controller502 of FIG. 5) could communicate with a mobile device through anassociated integrated wireless network processor circuit 1000 using theJSON communication stack 1016. In some examples, custom iPhone and/orAndroid applications can be designed to interface with the integratedwireless network processor circuit 1000 using the JSON communicationstack 1016. Additionally, other IoT systems that support RESTful JSONmessaging can be used to wirelessly monitor and control a device incommunication with the integrated wireless network processing circuit1000 using the JSON communication stack 1016.

The integrated wireless network processor chip 1000 is further shown toinclude an 802.11 b/g/n (Wi-Fi) communication protocol module 1020. Inone embodiment, the Wi-Fi communication protocol module 1020 includes acryptography engine 1022, a UDP/TCP protocol stack 1024, an IP protocolstack 1026, a supplicant 1028, and a Wi-Fi driver 1030. In oneembodiment, the cryptography engine 1022 can support secure andencrypted communications links between the integrated wireless networkprocessing chip 1000 and one or more other devices. For example thecryptography engines 1022 can be used to generate secure connectionssuch as TSL and/or SSL connections. The cryptography engine 1022 mayfurther be configured to use Wi-Fi security protocols such as WPS 2.0,WPA2 personal, and/or enterprise security. The communications module1010 can further include a media access control (MAC) module 1032, andan 802.11 baseband module 1034.

In some embodiments, the integrated wireless network processor chip 1000is configured to communicate using Wi-Fi, using the Wi-Fi driver 1030.For example, the integrated wireless network processor chip 1000 mayconnect to a router 1032, a user device 1034, a sensor 1036, an actuator1038, an HVAC device 1040, and/or one or more BMS devices 1042 using anyof a variety of WiFi modes (e.g., station, access point, WiFi direct,etc.). The user device 1034 can be a mobile device such as a smartphone,tablet, personal computer, etc. In some embodiments, the integratedwireless network processor chip includes a web server 1044 (e.g., anHTTP server). The web server 1044 may be configured to generate awebpage that can be loaded and rendered by a user device 1034 connectingdirectly to the integrated wireless network processor chip 1000. In oneembodiment, the user device 1034 can further communicate with theintegrated wireless network processor chip 1000 to connect directly tobuilding control network such as BACnet and/or JSON via the BACnetcommunication stack 1114 and the JSON communication stack 1016.

Still referring to FIG. 10, the integrated wireless network processorchip 1000 is shown to include control logic 1046 and data objects 1048.The control logic 1046 may include closed loop control, feedbackcontrol, PI control, model predictive control, or any other type ofautomated control methodology to control a variable affected byoperation of an associated BMS device, such as an HVAC device (e.g., atemperature within a building). The control logic 1046 may use the datareceived via the wireless radio 1004 to perform control operations. Forexample, the control logic may use data received from an HVAC device1040 via the wireless radio as inputs to a control algorithm todetermine an output for one or more BMS devices (e.g., dampers, airhandling units, chillers, boilers, fans, pumps, etc.) in order to affecta variable state or condition monitored by the device controller, suchas device controller 502. Advantageously, the control functionality of adevice controller may be implemented entirely by the integrated wirelessnetwork processor chip 1000 without requiring additional processing orcontrol components. For example, the processor 1006 can implement thecontrol logic 1046 without requiring additional processing by a devicecontroller. The data objects 1048 can include data point objects,control parameter objects, fault objects, settings objects, etc. In oneembodiment, the web server 1044 may select one or more of the dataobjects 1048 for inclusion in a web portal generated by the web server1044. The data objects 1048 may be stored as floating values, enumeratedvalues, text strings, and/or any other type of data format. Further, thedata objects 1048 can include data received from the user device 1034,sensors 1036, actuators 1038, HVAC devices 1040 and/or other BMS devices1042 coupled to the integrated wireless network processing circuit 1000.

Further, referring to FIG. 10, the integrated wireless network processorcircuit 1000 is shown to include an internet communication module 1050.In one embodiment, the internet communication module 1050 can providenotifications to a user via an internet connection. In one embodiment,the internet communication module 1050 accesses the internet using theUDP/TCP protocol stack 1024 and/or the IP protocol stack 1026 incombination with the wireless radio 1004. For example, the wirelessradio 1004 can communicate with the router 1032 to establish aconnection to the internet. The internet communication module 1050 canprovide a notification to a user by generating an electronic messagesuch as an e-mail or a text message. Additionally, the notification canbe provided to a user via a push notification provided to a mobiledevice. In one example, e-mail addresses and/or cellular telephonenumbers can be stored in the memory 1008 corresponding to relevantusers. In some embodiments, the notification can inform a user of afault condition. Other notifications can include needed maintenance,current status, or even a user defined data history. For example, a usermay request a notification providing historical data of one or more BMSdevices in communication with the integrated wireless network processorcircuit 1000. The integrated wireless network processor chip 1000 maygenerate the historical report based on the user input, and transmit thereport to the user via the internet communication module 1050.

Further, the internet communication module 1050 can allow for updates tobe provided to the integrated wireless network processor circuit 1000.For example, a firmware update may be able to be pushed to the wirelessnetwork processor circuit 1000 over the internet using the internetcommunication module 1050. In another embodiment, the internetcommunication module 1050 is used to allow for cloud based control ofthe integrated wireless networking processor circuit 1000. For example,the integrated wireless networking processor chip 1000 can be incommunication with one or more BMS devices. The integrated wirelessnetworking processor circuit 1000 can further be in communication with acloud based control system via the internet communication module 1050.The cloud based control system can then be accessed by users with theproper credentials via a connection to the internet. Based on apermission level of a user accessing the cloud based control system, auser can read and/or write values to certain parameters associated withBMS devices in communication with the integrated wireless networkprocessor circuit 1000 via a user interface.

Referring now to FIG. 11, an embodiment of an example user interface1100 that can be presented in a cloud based control system to a user canbe seen. The user interface 1100 can include an integration tree window1102. The integration tree window 1102 can allow the user to select oneor more parameters associated with a particular BMS device. For example,the BMS device can be an HVAC device, such as an AHU or VAV. In oneembodiment, the parameters associated with the user device can bedivided into types. For example, integration tree window 1102 dividesthe parameters of the connected BMS device into “Analog Inputs,” “AnalogOutputs” and “Binary Outputs” groups. Under each group, the individualparameters can be listed. For example, in the “Analog Inputs” group, theparameters can include temperature and humidity, as shown. A user canthen select which parameter they want to view using the user interface1100. The user interface 1100 can further include a details window 1104.The details window can provide details regarding the selected parameter.In some embodiments, the user can change the parameters in the detailwindow 1104 where the parameters are writable. In some embodiments, aparameter can be preset to be writable based on the type of parameterand BMS device. Further, a parameter may only be writable when a userhas provided the proper credentials.

Referring now to FIG. 12, a block diagram of a location determinationsystem 1200 is shown, according to one embodiment. In one embodiment, alocation of a device controller 1202 having an integrated wirelessnetwork processor chip 1204 is determined automatically using thewireless communication capabilities of the integrated wireless networkprocessor chip 1204. In one example the device controller 1202 can be adevice controller as discussed above in regards to FIG. 5. However, thewireless communications provided by the integrated wireless networkprocessor chip 1204 may allow the location of any other deviceimplementing the integrated wireless network processor chip 1204 to bedetermined automatically. The device controller 1202 may broadcast adevice ID 1206 using the integrated wireless network processor chip1204. One or more routers 1208, 1210 may detect the broadcasted deviceID 1206 and measure a signal strength associated therewith. Therouter(s) 1208, 1210 may report the detected device ID and the signalstrength to a BMS controller 1212 (e.g., a central controller for theBMS). The BMS controller 1212 may use this information to determine athree-dimensional location of the device controller 1202. For example,the BMS controller 1212 may use known locations of the router(s) 1208,1210 to determine a location that is likely to be within range of allthe router(s) 1208, 1210 that detect the same device controller 1202.The BMS controller 1212 may be configured to associate thethree-dimensional location with the device identifier 1206 and to storethe association in a locations database 1214.

Referring now to FIG. 13, a block diagram of a mesh network datarelaying system 1300 is shown, according to one embodiment. The system1300 may include a number of device controllers. As shown, the system1300 includes device controller “A” 1302 and device controller “B” 1304.Each device controller 1302, 1304 may include an integrated wirelessnetwork processor chip 1306, 1308. In one embodiment, the wirelesscommunications provided by the integrated wireless network processorchips 1306, 1308 allows the device controllers (or any other deviceimplementing the integrated wireless network processor chips 1306, 1308)to form a mesh for relaying data communications. This functionality maybe useful if one of the device controllers 1302, 1304 is located out ofwireless communication range of a router 1310, but within wirelesscommunication range of another one of the device controllers 1302, 1304.For example, FIG. 13 shows device controller “A” 1302 sending data todevice controller “B” 1304 via a wireless link between device controller“A” 1302 and device controller “B” 1304. Device controller “B” 1304 mayrelay data from device controller “A” 1302 to the router 1310, which canthen communicate the data to a BMS controller 1312, or other deviceconnected to the router 1310. In one example, the router 1310 cancommunicate the information to a cloud based server via an internetconnection. Communications may be provided from the router 1310 todevice controller “A” 1302 in a similar manner. For example, the router1310 may send data to device controller “B” 1304 via a wireless linkbetween the router 1310 and device controller “B” 1304. Devicecontroller “B” may relay the data from the router 1310 to devicecontroller “A” 1302. Although only two device controllers 1302, 1304 areshown in FIG. 13, it is contemplated that any number of devicecontrollers (or any other device implementing the integrated wirelessnetwork processor chip) may form a network mesh of any size orcomplexity. In some embodiments, the device controllers 1302, 1304 canbe configured to automatically configure themselves into a meshednetwork configuration.

Referring now to FIG. 14, a process 1400 for establishing acommunication network using an integrated wireless network processorchip is shown, according to one embodiment. At process step 1402, theintegrated wireless network processor chip can be initialized. In oneembodiment, initializing the integrated wireless network processorincludes initialization of the processor, one or more timers, and theinputs and outputs (I/O). In some examples, the I/O can be generalpurpose (GPIO) points on the integrated wireless network processor chip.The I/O can further be dedicated I/O, such as digital, analog, etc. Inone embodiment, the initialization process 1402 can be initiated duringa power-up period of the integrated wireless network processor chip. Atprocess block 1404, the integrated wireless network processor chip cansetup one or more wireless networks. For example, the integratedwireless network processor chip may setup a first network forcommunication with a number of BMS devices over an internal network,such as an BACnet network, a master/slave token passing (MSTP) network,or other wireless networks for communication with one or more BMSdevices. In other examples, the integrated wireless network processorchip could set up a general communication network for communication toother devices, such as routers, controllers (e.g. BMS controllers),mobile devices, etc. In one embodiment, the integrated wireless networkprocessor chip creates a JSON and/or RESTful JSON network forcommunication with mobile devices. However, other networks, such aZigbee, LoRA, LAN, TCP/IP, Wi-Fi, etc. can further be setup by theintegrated wireless network processor chip as applicable.

At decision block 1406, the integrated wireless network processor chipcan determine if it is connected to the one or more wireless networksthat the integrated wireless network processor chip set up at processblock 1404. In one embodiment, the integrated wireless network processorchip transmits a test message to the one or more networks requesting aresponse from the networks. In other examples, the integrated wirelessnetwork processor chip may passively monitor the networks fortransmissions made by other devices on the networks to determine if theintegrated wireless network processor chip is connected to the network.However, other methods of determining if the integrated wireless networkprocessor chip is connected to one or more networks are contemplated. Ifthe integrated wireless network processor chip determines that it is notconnected to the one or more networks set up in process block 1404, theprocess 1400 can return to process block 1404 to attempt to setup one ormore of the networks again to connect the integrated wireless networkprocessor chip to the desired networks. In one embodiment, the process1400 can attempt to connect the integrated wireless network processorchip to the network for a predetermined amount of time. If theintegrated wireless network processor chip is not able to connect to oneor more of the networks by the expiration of the predetermined time, theprocess 1400 may time out. In some examples, the predetermined amount oftime can be about ten seconds; however, predetermined amounts of timegreater than ten seconds and less than ten seconds are also considered.In other embodiments, the process 1400 can attempt to connect theintegrated wireless network processor chip to the networks for apredetermined number of attempts. If the integrated wireless networkprocessor chip is not able to connect to one or more of the networks inthe predetermined number of attempts, the process 1400 may time out. Insome examples, the predetermined number of attempts can be ten attempts;however, more than ten attempts or less than ten attempts are alsoconsidered. The integrated wireless network processor chip may provide anotification or alert to a user. For example, an illumination devicesuch as an LED on the integrated wireless network processor chip mayflash in a sequence or pattern to indicate that the process had timedout.

If the process 1400 determines that connection to the one or morenetworks has been established at process block 1406, the process 1400can proceed to process block 1408. At process block 1408, the integratedwireless network processor chip can process data requested or receivedon a first network. For example, the integrated wireless networkprocessor chip may receive a request for a status of one device from aseparate device on the first network. The process 1400 can then proceedto process block 1410, where the integrated wireless network processorchip can process data requested or received on a second network, ifapplicable. Once the data has been processed in process blocks 1408 and1410, the integrated wireless network processor chip can updateparameters at process block 1412. In one embodiment, the integratedwireless network processor chip can update the I/O based on theprocessed data. In other examples, the integrated wireless networkprocessor chip can provide updated parameters to other devices connectedto the one or more networks, based on the processed data. The process1400 can then return to process block 1406 to verify the connection tothe one or more networks and continuing to process data from the one ormore networks.

Configuration of Exemplary Embodiments

The construction and arrangement of the systems and methods as shown inthe various exemplary embodiments are illustrative only. Although only afew embodiments have been described in detail in this disclosure, manymodifications are possible (e.g., variations in sizes, dimensions,structures, shapes and proportions of the various elements, values ofparameters, mounting arrangements, use of materials, colors,orientations, etc.). For example, the position of elements may bereversed or otherwise varied and the nature or number of discreteelements or positions may be altered or varied. Accordingly, all suchmodifications are intended to be included within the scope of thepresent disclosure. The order or sequence of any process or method stepsmay be varied or re-sequenced according to alternative embodiments.Other substitutions, modifications, changes, and omissions may be madein the design, operating conditions and arrangement of the exemplaryembodiments without departing from the scope of the present disclosure.

The present disclosure contemplates methods, systems and programproducts on any machine-readable media for accomplishing variousoperations. The embodiments of the present disclosure may be implementedusing existing computer processors, or by a special purpose computerprocessor for an appropriate system, incorporated for this or anotherpurpose, or by a hardwired system. Embodiments within the scope of thepresent disclosure include program products comprising machine-readablemedia for carrying or having machine-executable instructions or datastructures stored thereon. Such machine-readable media can be anyavailable media that can be accessed by a general purpose or specialpurpose computer or other machine with a processor. By way of example,such machine-readable media can comprise RAM, ROM, EPROM, EEPROM, CD-ROMor other optical disk storage, magnetic disk storage or other magneticstorage devices, or any other medium which can be used to carry or storedesired program code in the form of machine-executable instructions ordata structures and which can be accessed by a general purpose orspecial purpose computer or other machine with a processor. Wheninformation is transferred or provided over a network or anothercommunications connection (either hardwired, wireless, or a combinationof hardwired or wireless) to a machine, the machine properly views theconnection as a machine-readable medium. Thus, any such connection isproperly termed a machine-readable medium. Combinations of the above arealso included within the scope of machine-readable media.Machine-executable instructions include, for example, instructions anddata which cause a general purpose computer, special purpose computer,or special purpose processing machines to perform a certain function orgroup of functions.

Although the figures show a specific order of method steps, the order ofthe steps may differ from what is depicted. Also two or more steps maybe performed concurrently or with partial concurrence. Such variationwill depend on the software and hardware systems chosen and on designerchoice. All such variations are within the scope of the disclosure.Likewise, software implementations could be accomplished with standardprogramming techniques with rule based logic and other logic toaccomplish the various connection steps, processing steps, comparisonsteps and decision steps.

What is claimed is:
 1. A controller in a building management system(BMS), the controller comprising: an integrated wireless networkprocessor chip comprising: a wireless radio configured to communicatewith one or more BMS devices; a processor in communication with thewireless radio and located on a same chip as the wireless radio; andmemory in communication with the wireless radio and located on the samechip as the wireless radio and the processor, the memory comprisingcommunication stacks configured to facilitate communication using abuilding automation and control network communications protocol and aWi-Fi communications protocol, wherein the integrated wireless networkprocessor chip provides the communication with the one or more BMSdevices with a user device configured to access one or more of the BMSdevices using an application installed on the user device; wherein theintegrated wireless network processor chip is configured to receive datafrom the one or more BMS devices via the wireless radio, format the datafrom the one or more BMS devices using the processor, and send the datafrom the one or more BMS devices via the wireless radio to the userdevice using the Wi-Fi communications protocol.
 2. The controller ofclaim 1, wherein the wireless radio is an 802.11 b/g/n Wi-Fi radio andthe controller comprises an interface for providing a temperaturesetpoint and receives a temperature parameter.
 3. The controller ofclaim 1, wherein the communications stacks are configured to facilitatecommunications using a JavaScript Object Notation communicationsprotocol.
 4. The controller of claim 1, wherein the memory comprises aweb server configured to generate a web page and serve the web page tothe user device via the wireless radio.
 5. The controller of claim 4,wherein the web page comprises at least one of the data from the BMSdevices, configuration information for the thermostat, and commissioninginformation for the thermostat.
 6. The controller of claim 1, whereinthe memory comprises control logic configured to use the data from theBMS devices to generate a control output that is communicated to the BMSdevices via the wireless radio.
 7. The controller of claim 1, whereinthe memory comprises a cryptography engine configured to encrypt ordecrypt data communicated via the wireless radio.
 8. The controller ofclaim 1, wherein the integrated wireless network processor chip isconfigured to receive data from another integrated wireless networkprocessor chip in another thermostat and relay the data to a router outof range of the other thermostat.
 9. A building management system, thesystem comprising: one or more heating, ventilating or air conditioning(HVAC) devices; and an HVAC controller, the HVAC controller comprisingan integrated wireless network processor chip, the integrated wirelessnetwork processor chip comprising: a wireless radio configured tocommunicate with the one or more HVAC devices; a processor incommunication with the wireless radio and located on a same chip as thewireless radio; and memory in communication with the wireless radio andlocated on the same chip as the wireless radio and the processor;wherein the integrated wireless network processor chip providescommunication with the one or more HVAC devices using a firstcommunication protocol associated with a first communication stackcontained in the memory, and provides communication with a user deviceusing a second communication protocol associated with a secondcommunication stack contained in the memory.
 10. The system of claim 9,wherein the first communication protocol is a building automation andcontrol network protocol and the second communication protocol is aWi-Fi protocol.
 11. The system of claim 9, wherein the secondcommunication stack facilities communication using a JavaScript ObjectNotation communications protocol.
 12. The system of claim 9, wherein thememory further includes a third communication stack.
 13. The system ofclaim 9, wherein the integrated wireless network processor chip furthercomprises control logic.
 14. The system of claim 13, wherein the controllogic controls the one or more HVAC devices.
 15. The system of claim 9,wherein the integrated wireless network processor chip is configured toprovide a user interface on the user device, the user interfacecomprising at least one of data from the one or more HVAC devices,configuration information for the HVAC controller, and commissioninginformation for the HVAC controller.
 16. A controller for a heating,ventilating or air conditioning (HVAC) system, the controllercomprising: an interface configured to receive a temperature setpointand display a temperature parameter; an integrated wireless networkprocessor chip comprising: a wireless radio; a processor incommunication with the wireless radio and located on a same chip as thewireless radio; and memory in communication with the wireless radio andlocated on the same chip as the wireless radio and the processor, thememory comprising communication stacks configured to facilitatecommunication using a building automation and control networkcommunications protocol and a Wi-Fi communications protocol, wherein theintegrated wireless network processor chip provides communication with aBMS device using the building automation and control networkcommunications protocol and provides communication with a user deviceusing an application installed on the user device configured to providea user interface for communicating via the wireless radio using theWi-Fi communications protocol.
 17. The controller of claim 16, whereinthe controller is configured to display a humidity parameter.
 18. Thecontroller of claim 16, wherein the controller is configured to displaya fan speed parameter.
 19. The controller of claim 16, wherein thecontroller is configured to provide control in an air handling unitapplication.
 20. The controller of claim 16, further comprising: aninput for receiving a temperature measurement from a remote source. 21.The controller of claim 16, further comprising: an input for receivingan occupancy signal.
 22. The controller of claim 16, wherein theprocessor is configured to broadcast a unique device identification forthe controller.
 23. The controller of claim 16, wherein the memorycomprises a web server configured to generate a web page and serve theweb page to the user device via the wireless radio.
 24. The controllerof claim 23, wherein the wireless radio is an 802.11 b/g/n Wi-Fi radioand the building automation and control network communications protocolis a BACnet protocol.
 25. The controller of claim 21, wherein the userinterface is for reading and writing to the BMS device via thecontroller using the building automation and control networkcommunications protocol and the Wi-Fi communications protocol.